Path:OKDatasheet > Dane Semiconductor > Power Innovations Datasheet > TISP3250H3SL
TISP3250H3SL spec: Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection
Path:OKDatasheet > Dane Semiconductor > Power Innovations Datasheet > TISP3250H3SL
TISP3250H3SL spec: Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection
Producent : Power Innovations
Opakowanie : SL
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Temperatura : Min 0 °C | Max 0 °C
Rozmiar : 254 KB
Zastosowanie : Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection