U0408FC08C spec: 8.0V; 200W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards

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U0408FC08C Datasheet i Spec

Opakowanie :

Pins : 0

Temperatura : Min -55 °C | Max 150 °C

Rozmiar : 126 KB

Zastosowanie : 8.0V; 200W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards