Path:OKDatasheet > Dane Semiconductor > Winbond Datasheet > W66662CF
W66662CF spec: Highly integrated CCD/CIS analog end signal processor
W66662CF Datasheet i Spec
Producent : Winbond
Opakowanie : QFP48
Pins : 48
Temperatura : Min 0 °C | Max 70 °C
Rozmiar : 299 KB
Zastosowanie : Highly integrated CCD/CIS analog end signal processor
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